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Bibliographic details for 18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Page name: 18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 14 June 2024 05:30 UTC
- Date retrieved: 6 July 2024 22:20 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18524094._SEMICONDUCTOR_PACKAGE_INCLUDING_A_PLURALITY_OF_DIFFERENT_STACKED_CHIPS_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72849
- Page Version ID: 72849
Citation styles for 18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APA style
18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, June 14). WikiPatents, . Retrieved 22:20, July 6, 2024 from http://wikipatents.org/index.php?title=18524094._SEMICONDUCTOR_PACKAGE_INCLUDING_A_PLURALITY_OF_DIFFERENT_STACKED_CHIPS_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72849.
MLA style
"18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 14 Jun 2024, 05:30 UTC. 6 Jul 2024, 22:20 <http://wikipatents.org/index.php?title=18524094._SEMICONDUCTOR_PACKAGE_INCLUDING_A_PLURALITY_OF_DIFFERENT_STACKED_CHIPS_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72849>.
MHRA style
WikiPatents contributors, '18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 14 June 2024, 05:30 UTC, <http://wikipatents.org/index.php?title=18524094._SEMICONDUCTOR_PACKAGE_INCLUDING_A_PLURALITY_OF_DIFFERENT_STACKED_CHIPS_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72849> [accessed 6 July 2024]
Chicago style
WikiPatents contributors, "18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18524094._SEMICONDUCTOR_PACKAGE_INCLUDING_A_PLURALITY_OF_DIFFERENT_STACKED_CHIPS_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72849 (accessed July 6, 2024).
CBE/CSE style
WikiPatents contributors. 18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 14, 05:30 UTC [cited 2024 Jul 6]. Available from: http://wikipatents.org/index.php?title=18524094._SEMICONDUCTOR_PACKAGE_INCLUDING_A_PLURALITY_OF_DIFFERENT_STACKED_CHIPS_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72849.
Bluebook style
18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18524094._SEMICONDUCTOR_PACKAGE_INCLUDING_A_PLURALITY_OF_DIFFERENT_STACKED_CHIPS_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72849 (last visited July 6, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18524094._SEMICONDUCTOR_PACKAGE_INCLUDING_A_PLURALITY_OF_DIFFERENT_STACKED_CHIPS_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72849", note = "[Online; accessed 6-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18524094. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CHIPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18524094._SEMICONDUCTOR_PACKAGE_INCLUDING_A_PLURALITY_OF_DIFFERENT_STACKED_CHIPS_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_PACKAGE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72849}", note = "[Online; accessed 6-July-2024]" }