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Bibliographic details for 18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, June 14). WikiPatents, . Retrieved 06:31, July 4, 2024 from http://wikipatents.org/index.php?title=18380042._SEMICONDUCTOR_PACKAGE_INCLUDING_SEMICONDUCTOR_CHIP_HAVING_THROUGH-ELECTRODE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72833.

MLA style

"18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 14 Jun 2024, 05:28 UTC. 4 Jul 2024, 06:31 <http://wikipatents.org/index.php?title=18380042._SEMICONDUCTOR_PACKAGE_INCLUDING_SEMICONDUCTOR_CHIP_HAVING_THROUGH-ELECTRODE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72833>.

MHRA style

WikiPatents contributors, '18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 14 June 2024, 05:28 UTC, <http://wikipatents.org/index.php?title=18380042._SEMICONDUCTOR_PACKAGE_INCLUDING_SEMICONDUCTOR_CHIP_HAVING_THROUGH-ELECTRODE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72833> [accessed 4 July 2024]

Chicago style

WikiPatents contributors, "18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18380042._SEMICONDUCTOR_PACKAGE_INCLUDING_SEMICONDUCTOR_CHIP_HAVING_THROUGH-ELECTRODE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72833 (accessed July 4, 2024).

CBE/CSE style

WikiPatents contributors. 18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 14, 05:28 UTC [cited 2024 Jul 4]. Available from: http://wikipatents.org/index.php?title=18380042._SEMICONDUCTOR_PACKAGE_INCLUDING_SEMICONDUCTOR_CHIP_HAVING_THROUGH-ELECTRODE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72833.

Bluebook style

18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18380042._SEMICONDUCTOR_PACKAGE_INCLUDING_SEMICONDUCTOR_CHIP_HAVING_THROUGH-ELECTRODE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72833 (last visited July 4, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18380042._SEMICONDUCTOR_PACKAGE_INCLUDING_SEMICONDUCTOR_CHIP_HAVING_THROUGH-ELECTRODE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72833",
   note = "[Online; accessed 4-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18380042. SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-ELECTRODE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18380042._SEMICONDUCTOR_PACKAGE_INCLUDING_SEMICONDUCTOR_CHIP_HAVING_THROUGH-ELECTRODE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=72833}",
   note = "[Online; accessed 4-July-2024]"
 }


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