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Bibliographic details for Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract
- Page name: Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 14 June 2024 05:10 UTC
- Date retrieved: 27 June 2024 08:07 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194630)._BONDABLE_PILLARS_FOR_WIRE_BONDS_IN_A_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=72666
- Page Version ID: 72666
Citation styles for Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract
APA style
Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract. (2024, June 14). WikiPatents, . Retrieved 08:07, June 27, 2024 from http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194630)._BONDABLE_PILLARS_FOR_WIRE_BONDS_IN_A_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=72666.
MLA style
"Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract." WikiPatents, . 14 Jun 2024, 05:10 UTC. 27 Jun 2024, 08:07 <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194630)._BONDABLE_PILLARS_FOR_WIRE_BONDS_IN_A_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=72666>.
MHRA style
WikiPatents contributors, 'Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract', WikiPatents, , 14 June 2024, 05:10 UTC, <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194630)._BONDABLE_PILLARS_FOR_WIRE_BONDS_IN_A_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=72666> [accessed 27 June 2024]
Chicago style
WikiPatents contributors, "Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194630)._BONDABLE_PILLARS_FOR_WIRE_BONDS_IN_A_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=72666 (accessed June 27, 2024).
CBE/CSE style
WikiPatents contributors. Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract [Internet]. WikiPatents, ; 2024 Jun 14, 05:10 UTC [cited 2024 Jun 27]. Available from: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194630)._BONDABLE_PILLARS_FOR_WIRE_BONDS_IN_A_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=72666.
Bluebook style
Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract, http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194630)._BONDABLE_PILLARS_FOR_WIRE_BONDS_IN_A_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=72666 (last visited June 27, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194630)._BONDABLE_PILLARS_FOR_WIRE_BONDS_IN_A_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=72666",
note = "[Online; accessed 27-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Micron technology, inc. (20240194630). BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194630)._BONDABLE_PILLARS_FOR_WIRE_BONDS_IN_A_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=72666}",
note = "[Online; accessed 27-June-2024]"
}
