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Bibliographic details for Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract
- Page name: Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 14 June 2024 05:10 UTC
- Date retrieved: 7 July 2024 20:10 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664
- Page Version ID: 72664
Citation styles for Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract
APA style
Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract. (2024, June 14). WikiPatents, . Retrieved 20:10, July 7, 2024 from http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664.
MLA style
"Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract." WikiPatents, . 14 Jun 2024, 05:10 UTC. 7 Jul 2024, 20:10 <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664>.
MHRA style
WikiPatents contributors, 'Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract', WikiPatents, , 14 June 2024, 05:10 UTC, <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664> [accessed 7 July 2024]
Chicago style
WikiPatents contributors, "Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664 (accessed July 7, 2024).
CBE/CSE style
WikiPatents contributors. Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract [Internet]. WikiPatents, ; 2024 Jun 14, 05:10 UTC [cited 2024 Jul 7]. Available from: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664.
Bluebook style
Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract, http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664 (last visited July 7, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664", note = "[Online; accessed 7-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664}", note = "[Online; accessed 7-July-2024]" }