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Bibliographic details for Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract
- Page name: Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 14 June 2024 05:10 UTC
- Date retrieved: 16 July 2024 17:58 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664
- Page Version ID: 72664
Citation styles for Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract
APA style
Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract. (2024, June 14). WikiPatents, . Retrieved 17:58, July 16, 2024 from http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664.
MLA style
"Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract." WikiPatents, . 14 Jun 2024, 05:10 UTC. 16 Jul 2024, 17:58 <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664>.
MHRA style
WikiPatents contributors, 'Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract', WikiPatents, , 14 June 2024, 05:10 UTC, <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664> [accessed 16 July 2024]
Chicago style
WikiPatents contributors, "Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664 (accessed July 16, 2024).
CBE/CSE style
WikiPatents contributors. Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract [Internet]. WikiPatents, ; 2024 Jun 14, 05:10 UTC [cited 2024 Jul 16]. Available from: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664.
Bluebook style
Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract, http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664 (last visited July 16, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664", note = "[Online; accessed 16-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Micron technology, inc. (20240194549). SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240194549)._SEMICONDUCTOR_DEVICE_ASSEMBLIES_WITH_AN_ENCAPSULANT_MATERIAL_HAVING_ENHANCED_THERMAL_CONDUCTIVITY,_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract&oldid=72664}", note = "[Online; accessed 16-July-2024]" }