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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract
- Page name: Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 14 June 2024 04:21 UTC
- Date retrieved: 1 July 2024 02:13 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240190701)._METHODS_FOR_WAFER_BONDING_simplified_abstract&oldid=72194
- Page Version ID: 72194
Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract
APA style
Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract. (2024, June 14). WikiPatents, . Retrieved 02:13, July 1, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240190701)._METHODS_FOR_WAFER_BONDING_simplified_abstract&oldid=72194.
MLA style
"Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract." WikiPatents, . 14 Jun 2024, 04:21 UTC. 1 Jul 2024, 02:13 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240190701)._METHODS_FOR_WAFER_BONDING_simplified_abstract&oldid=72194>.
MHRA style
WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract', WikiPatents, , 14 June 2024, 04:21 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240190701)._METHODS_FOR_WAFER_BONDING_simplified_abstract&oldid=72194> [accessed 1 July 2024]
Chicago style
WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240190701)._METHODS_FOR_WAFER_BONDING_simplified_abstract&oldid=72194 (accessed July 1, 2024).
CBE/CSE style
WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract [Internet]. WikiPatents, ; 2024 Jun 14, 04:21 UTC [cited 2024 Jul 1]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240190701)._METHODS_FOR_WAFER_BONDING_simplified_abstract&oldid=72194.
Bluebook style
Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240190701)._METHODS_FOR_WAFER_BONDING_simplified_abstract&oldid=72194 (last visited July 1, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240190701)._METHODS_FOR_WAFER_BONDING_simplified_abstract&oldid=72194",
note = "[Online; accessed 1-July-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240190701)._METHODS_FOR_WAFER_BONDING_simplified_abstract&oldid=72194}",
note = "[Online; accessed 1-July-2024]"
}
