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Bibliographic details for US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract

Citation styles for US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract

APA style

US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract. (2023, November 10). WikiPatents, . Retrieved 23:58, June 25, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18216040._MICRO_THROUGH-SILICON_VIA_FOR_TRANSISTOR_DENSITY_SCALING_simplified_abstract&oldid=7151.

MLA style

"US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract." WikiPatents, . 10 Nov 2023, 06:45 UTC. 25 Jun 2024, 23:58 <http://wikipatents.org/index.php?title=US_Patent_Application_18216040._MICRO_THROUGH-SILICON_VIA_FOR_TRANSISTOR_DENSITY_SCALING_simplified_abstract&oldid=7151>.

MHRA style

WikiPatents contributors, 'US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract', WikiPatents, , 10 November 2023, 06:45 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18216040._MICRO_THROUGH-SILICON_VIA_FOR_TRANSISTOR_DENSITY_SCALING_simplified_abstract&oldid=7151> [accessed 25 June 2024]

Chicago style

WikiPatents contributors, "US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18216040._MICRO_THROUGH-SILICON_VIA_FOR_TRANSISTOR_DENSITY_SCALING_simplified_abstract&oldid=7151 (accessed June 25, 2024).

CBE/CSE style

WikiPatents contributors. US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract [Internet]. WikiPatents, ; 2023 Nov 10, 06:45 UTC [cited 2024 Jun 25]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18216040._MICRO_THROUGH-SILICON_VIA_FOR_TRANSISTOR_DENSITY_SCALING_simplified_abstract&oldid=7151.

Bluebook style

US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18216040._MICRO_THROUGH-SILICON_VIA_FOR_TRANSISTOR_DENSITY_SCALING_simplified_abstract&oldid=7151 (last visited June 25, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=US_Patent_Application_18216040._MICRO_THROUGH-SILICON_VIA_FOR_TRANSISTOR_DENSITY_SCALING_simplified_abstract&oldid=7151",
   note = "[Online; accessed 25-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18216040. MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18216040._MICRO_THROUGH-SILICON_VIA_FOR_TRANSISTOR_DENSITY_SCALING_simplified_abstract&oldid=7151}",
   note = "[Online; accessed 25-June-2024]"
 }


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