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Citation styles for 18168380. BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18168380. BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, June 10). WikiPatents, . Retrieved 23:36, July 2, 2024 from http://wikipatents.org/index.php?title=18168380._BRUSH_FOR_CLEANING_WAFERS_AFTER_CHEMICAL_MECHANICAL_POLISHING_(CMP)_PROCESS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=69539.

MLA style

"18168380. BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 10 Jun 2024, 08:21 UTC. 2 Jul 2024, 23:36 <http://wikipatents.org/index.php?title=18168380._BRUSH_FOR_CLEANING_WAFERS_AFTER_CHEMICAL_MECHANICAL_POLISHING_(CMP)_PROCESS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=69539>.

MHRA style

WikiPatents contributors, '18168380. BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 10 June 2024, 08:21 UTC, <http://wikipatents.org/index.php?title=18168380._BRUSH_FOR_CLEANING_WAFERS_AFTER_CHEMICAL_MECHANICAL_POLISHING_(CMP)_PROCESS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=69539> [accessed 2 July 2024]

Chicago style

WikiPatents contributors, "18168380. BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18168380._BRUSH_FOR_CLEANING_WAFERS_AFTER_CHEMICAL_MECHANICAL_POLISHING_(CMP)_PROCESS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=69539 (accessed July 2, 2024).

CBE/CSE style

WikiPatents contributors. 18168380. BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jun 10, 08:21 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=18168380._BRUSH_FOR_CLEANING_WAFERS_AFTER_CHEMICAL_MECHANICAL_POLISHING_(CMP)_PROCESS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=69539.

Bluebook style

18168380. BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18168380._BRUSH_FOR_CLEANING_WAFERS_AFTER_CHEMICAL_MECHANICAL_POLISHING_(CMP)_PROCESS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=69539 (last visited July 2, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18168380. BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18168380._BRUSH_FOR_CLEANING_WAFERS_AFTER_CHEMICAL_MECHANICAL_POLISHING_(CMP)_PROCESS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=69539",
   note = "[Online; accessed 2-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18168380. BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18168380._BRUSH_FOR_CLEANING_WAFERS_AFTER_CHEMICAL_MECHANICAL_POLISHING_(CMP)_PROCESS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=69539}",
   note = "[Online; accessed 2-July-2024]"
 }