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Bibliographic details for 18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation)

Citation styles for 18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation)

APA style

18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation). (2024, June 10). WikiPatents, . Retrieved 00:37, July 8, 2024 from http://wikipatents.org/index.php?title=18060596._THERMOCOMPRESSION_BONDING_TOOL_FOR_PANEL-LEVEL_THERMO-COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=69199.

MLA style

"18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation)." WikiPatents, . 10 Jun 2024, 07:44 UTC. 8 Jul 2024, 00:37 <http://wikipatents.org/index.php?title=18060596._THERMOCOMPRESSION_BONDING_TOOL_FOR_PANEL-LEVEL_THERMO-COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=69199>.

MHRA style

WikiPatents contributors, '18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation)', WikiPatents, , 10 June 2024, 07:44 UTC, <http://wikipatents.org/index.php?title=18060596._THERMOCOMPRESSION_BONDING_TOOL_FOR_PANEL-LEVEL_THERMO-COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=69199> [accessed 8 July 2024]

Chicago style

WikiPatents contributors, "18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18060596._THERMOCOMPRESSION_BONDING_TOOL_FOR_PANEL-LEVEL_THERMO-COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=69199 (accessed July 8, 2024).

CBE/CSE style

WikiPatents contributors. 18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jun 10, 07:44 UTC [cited 2024 Jul 8]. Available from: http://wikipatents.org/index.php?title=18060596._THERMOCOMPRESSION_BONDING_TOOL_FOR_PANEL-LEVEL_THERMO-COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=69199.

Bluebook style

18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18060596._THERMOCOMPRESSION_BONDING_TOOL_FOR_PANEL-LEVEL_THERMO-COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=69199 (last visited July 8, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18060596._THERMOCOMPRESSION_BONDING_TOOL_FOR_PANEL-LEVEL_THERMO-COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=69199",
   note = "[Online; accessed 8-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18060596. THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18060596._THERMOCOMPRESSION_BONDING_TOOL_FOR_PANEL-LEVEL_THERMO-COMPRESSION_BONDING_simplified_abstract_(Intel_Corporation)&oldid=69199}",
   note = "[Online; accessed 8-July-2024]"
 }


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