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Bibliographic details for 18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Page name: 18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 10 June 2024 04:54 UTC
- Date retrieved: 2 July 2024 05:10 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18239454._DIE_BONDING_APPARATUS_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68733
- Page Version ID: 68733
Citation styles for 18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APA style
18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, June 10). WikiPatents, . Retrieved 05:10, July 2, 2024 from http://wikipatents.org/index.php?title=18239454._DIE_BONDING_APPARATUS_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68733.
MLA style
"18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 10 Jun 2024, 04:54 UTC. 2 Jul 2024, 05:10 <http://wikipatents.org/index.php?title=18239454._DIE_BONDING_APPARATUS_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68733>.
MHRA style
WikiPatents contributors, '18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 10 June 2024, 04:54 UTC, <http://wikipatents.org/index.php?title=18239454._DIE_BONDING_APPARATUS_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68733> [accessed 2 July 2024]
Chicago style
WikiPatents contributors, "18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18239454._DIE_BONDING_APPARATUS_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68733 (accessed July 2, 2024).
CBE/CSE style
WikiPatents contributors. 18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 10, 04:54 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=18239454._DIE_BONDING_APPARATUS_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68733.
Bluebook style
18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18239454._DIE_BONDING_APPARATUS_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68733 (last visited July 2, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18239454._DIE_BONDING_APPARATUS_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68733",
note = "[Online; accessed 2-July-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18239454._DIE_BONDING_APPARATUS_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68733}",
note = "[Online; accessed 2-July-2024]"
}
