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Bibliographic details for 18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, June 10). WikiPatents, . Retrieved 05:51, June 28, 2024 from http://wikipatents.org/index.php?title=18437385._THERMAL_INTERFACE_MATERIAL,_METHOD_OF_MANUFACTURING_THE_SAME,_AND_SEMICONDUCTOR_PACKAGES_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68728.

MLA style

"18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 10 Jun 2024, 04:48 UTC. 28 Jun 2024, 05:51 <http://wikipatents.org/index.php?title=18437385._THERMAL_INTERFACE_MATERIAL,_METHOD_OF_MANUFACTURING_THE_SAME,_AND_SEMICONDUCTOR_PACKAGES_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68728>.

MHRA style

WikiPatents contributors, '18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 10 June 2024, 04:48 UTC, <http://wikipatents.org/index.php?title=18437385._THERMAL_INTERFACE_MATERIAL,_METHOD_OF_MANUFACTURING_THE_SAME,_AND_SEMICONDUCTOR_PACKAGES_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68728> [accessed 28 June 2024]

Chicago style

WikiPatents contributors, "18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18437385._THERMAL_INTERFACE_MATERIAL,_METHOD_OF_MANUFACTURING_THE_SAME,_AND_SEMICONDUCTOR_PACKAGES_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68728 (accessed June 28, 2024).

CBE/CSE style

WikiPatents contributors. 18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 10, 04:48 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=18437385._THERMAL_INTERFACE_MATERIAL,_METHOD_OF_MANUFACTURING_THE_SAME,_AND_SEMICONDUCTOR_PACKAGES_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68728.

Bluebook style

18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18437385._THERMAL_INTERFACE_MATERIAL,_METHOD_OF_MANUFACTURING_THE_SAME,_AND_SEMICONDUCTOR_PACKAGES_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68728 (last visited June 28, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18437385._THERMAL_INTERFACE_MATERIAL,_METHOD_OF_MANUFACTURING_THE_SAME,_AND_SEMICONDUCTOR_PACKAGES_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68728",
   note = "[Online; accessed 28-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18437385. THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18437385._THERMAL_INTERFACE_MATERIAL,_METHOD_OF_MANUFACTURING_THE_SAME,_AND_SEMICONDUCTOR_PACKAGES_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=68728}",
   note = "[Online; accessed 28-June-2024]"
 }


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