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Bibliographic details for Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract

Citation styles for Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract

APA style

Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract. (2024, June 10). WikiPatents, . Retrieved 05:22, June 28, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240186264)._POLYMER_LAYERS_FOR_ADHESIVE_PROMOTION_AND_STRESS_MANAGEMENT_IN_GLASS_LAYERS_IN_INTEGRATED_CIRCUIT_DEVICES_simplified_abstract&oldid=67565.

MLA style

"Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract." WikiPatents, . 10 Jun 2024, 02:21 UTC. 28 Jun 2024, 05:22 <http://wikipatents.org/index.php?title=Intel_corporation_(20240186264)._POLYMER_LAYERS_FOR_ADHESIVE_PROMOTION_AND_STRESS_MANAGEMENT_IN_GLASS_LAYERS_IN_INTEGRATED_CIRCUIT_DEVICES_simplified_abstract&oldid=67565>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract', WikiPatents, , 10 June 2024, 02:21 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240186264)._POLYMER_LAYERS_FOR_ADHESIVE_PROMOTION_AND_STRESS_MANAGEMENT_IN_GLASS_LAYERS_IN_INTEGRATED_CIRCUIT_DEVICES_simplified_abstract&oldid=67565> [accessed 28 June 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240186264)._POLYMER_LAYERS_FOR_ADHESIVE_PROMOTION_AND_STRESS_MANAGEMENT_IN_GLASS_LAYERS_IN_INTEGRATED_CIRCUIT_DEVICES_simplified_abstract&oldid=67565 (accessed June 28, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract [Internet]. WikiPatents, ; 2024 Jun 10, 02:21 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240186264)._POLYMER_LAYERS_FOR_ADHESIVE_PROMOTION_AND_STRESS_MANAGEMENT_IN_GLASS_LAYERS_IN_INTEGRATED_CIRCUIT_DEVICES_simplified_abstract&oldid=67565.

Bluebook style

Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240186264)._POLYMER_LAYERS_FOR_ADHESIVE_PROMOTION_AND_STRESS_MANAGEMENT_IN_GLASS_LAYERS_IN_INTEGRATED_CIRCUIT_DEVICES_simplified_abstract&oldid=67565 (last visited June 28, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240186264)._POLYMER_LAYERS_FOR_ADHESIVE_PROMOTION_AND_STRESS_MANAGEMENT_IN_GLASS_LAYERS_IN_INTEGRATED_CIRCUIT_DEVICES_simplified_abstract&oldid=67565",
   note = "[Online; accessed 28-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240186264). POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240186264)._POLYMER_LAYERS_FOR_ADHESIVE_PROMOTION_AND_STRESS_MANAGEMENT_IN_GLASS_LAYERS_IN_INTEGRATED_CIRCUIT_DEVICES_simplified_abstract&oldid=67565}",
   note = "[Online; accessed 28-June-2024]"
 }


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