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Bibliographic details for Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Page name: Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 10 June 2024 02:20 UTC
- Date retrieved: 28 June 2024 21:20 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Intel_corporation_(20240186228)._INTEGRATED_CIRCUIT_PACKAGE_ARCHITECTURES_WITH_CORE_AND/OR_BUILD-UP_LAYERS_COMPRISING_SPIN-ON_GLASS_(SOG)_simplified_abstract&oldid=67560
- Page Version ID: 67560
Citation styles for Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
APA style
Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract. (2024, June 10). WikiPatents, . Retrieved 21:20, June 28, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240186228)._INTEGRATED_CIRCUIT_PACKAGE_ARCHITECTURES_WITH_CORE_AND/OR_BUILD-UP_LAYERS_COMPRISING_SPIN-ON_GLASS_(SOG)_simplified_abstract&oldid=67560.
MLA style
"Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract." WikiPatents, . 10 Jun 2024, 02:20 UTC. 28 Jun 2024, 21:20 <http://wikipatents.org/index.php?title=Intel_corporation_(20240186228)._INTEGRATED_CIRCUIT_PACKAGE_ARCHITECTURES_WITH_CORE_AND/OR_BUILD-UP_LAYERS_COMPRISING_SPIN-ON_GLASS_(SOG)_simplified_abstract&oldid=67560>.
MHRA style
WikiPatents contributors, 'Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract', WikiPatents, , 10 June 2024, 02:20 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240186228)._INTEGRATED_CIRCUIT_PACKAGE_ARCHITECTURES_WITH_CORE_AND/OR_BUILD-UP_LAYERS_COMPRISING_SPIN-ON_GLASS_(SOG)_simplified_abstract&oldid=67560> [accessed 28 June 2024]
Chicago style
WikiPatents contributors, "Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240186228)._INTEGRATED_CIRCUIT_PACKAGE_ARCHITECTURES_WITH_CORE_AND/OR_BUILD-UP_LAYERS_COMPRISING_SPIN-ON_GLASS_(SOG)_simplified_abstract&oldid=67560 (accessed June 28, 2024).
CBE/CSE style
WikiPatents contributors. Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract [Internet]. WikiPatents, ; 2024 Jun 10, 02:20 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240186228)._INTEGRATED_CIRCUIT_PACKAGE_ARCHITECTURES_WITH_CORE_AND/OR_BUILD-UP_LAYERS_COMPRISING_SPIN-ON_GLASS_(SOG)_simplified_abstract&oldid=67560.
Bluebook style
Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240186228)._INTEGRATED_CIRCUIT_PACKAGE_ARCHITECTURES_WITH_CORE_AND/OR_BUILD-UP_LAYERS_COMPRISING_SPIN-ON_GLASS_(SOG)_simplified_abstract&oldid=67560 (last visited June 28, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240186228)._INTEGRATED_CIRCUIT_PACKAGE_ARCHITECTURES_WITH_CORE_AND/OR_BUILD-UP_LAYERS_COMPRISING_SPIN-ON_GLASS_(SOG)_simplified_abstract&oldid=67560", note = "[Online; accessed 28-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240186228)._INTEGRATED_CIRCUIT_PACKAGE_ARCHITECTURES_WITH_CORE_AND/OR_BUILD-UP_LAYERS_COMPRISING_SPIN-ON_GLASS_(SOG)_simplified_abstract&oldid=67560}", note = "[Online; accessed 28-June-2024]" }