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Bibliographic details for US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract

Citation styles for US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract

APA style

US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract. (2023, November 9). WikiPatents, . Retrieved 23:18, June 25, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_17738032._DIE_STACKING_STRUCTURE,_SEMICONDUCTOR_PACKAGE_AND_MANUFACTURING_METHOD_OF_THE_DIE_STACKING_STRUCTURE_simplified_abstract&oldid=6732.

MLA style

"US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract." WikiPatents, . 9 Nov 2023, 11:11 UTC. 25 Jun 2024, 23:18 <http://wikipatents.org/index.php?title=US_Patent_Application_17738032._DIE_STACKING_STRUCTURE,_SEMICONDUCTOR_PACKAGE_AND_MANUFACTURING_METHOD_OF_THE_DIE_STACKING_STRUCTURE_simplified_abstract&oldid=6732>.

MHRA style

WikiPatents contributors, 'US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract', WikiPatents, , 9 November 2023, 11:11 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_17738032._DIE_STACKING_STRUCTURE,_SEMICONDUCTOR_PACKAGE_AND_MANUFACTURING_METHOD_OF_THE_DIE_STACKING_STRUCTURE_simplified_abstract&oldid=6732> [accessed 25 June 2024]

Chicago style

WikiPatents contributors, "US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_17738032._DIE_STACKING_STRUCTURE,_SEMICONDUCTOR_PACKAGE_AND_MANUFACTURING_METHOD_OF_THE_DIE_STACKING_STRUCTURE_simplified_abstract&oldid=6732 (accessed June 25, 2024).

CBE/CSE style

WikiPatents contributors. US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract [Internet]. WikiPatents, ; 2023 Nov 9, 11:11 UTC [cited 2024 Jun 25]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_17738032._DIE_STACKING_STRUCTURE,_SEMICONDUCTOR_PACKAGE_AND_MANUFACTURING_METHOD_OF_THE_DIE_STACKING_STRUCTURE_simplified_abstract&oldid=6732.

Bluebook style

US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_17738032._DIE_STACKING_STRUCTURE,_SEMICONDUCTOR_PACKAGE_AND_MANUFACTURING_METHOD_OF_THE_DIE_STACKING_STRUCTURE_simplified_abstract&oldid=6732 (last visited June 25, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=US_Patent_Application_17738032._DIE_STACKING_STRUCTURE,_SEMICONDUCTOR_PACKAGE_AND_MANUFACTURING_METHOD_OF_THE_DIE_STACKING_STRUCTURE_simplified_abstract&oldid=6732",
   note = "[Online; accessed 25-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 17738032. DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE DIE STACKING STRUCTURE simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_17738032._DIE_STACKING_STRUCTURE,_SEMICONDUCTOR_PACKAGE_AND_MANUFACTURING_METHOD_OF_THE_DIE_STACKING_STRUCTURE_simplified_abstract&oldid=6732}",
   note = "[Online; accessed 25-June-2024]"
 }


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