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Citation styles for 18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)

APA style

18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.). (2024, June 6). WikiPatents, . Retrieved 06:37, July 4, 2024 from http://wikipatents.org/index.php?title=18401099._CONDUCTIVE_BUFFER_LAYERS_FOR_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=64666.

MLA style

"18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)." WikiPatents, . 6 Jun 2024, 02:18 UTC. 4 Jul 2024, 06:37 <http://wikipatents.org/index.php?title=18401099._CONDUCTIVE_BUFFER_LAYERS_FOR_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=64666>.

MHRA style

WikiPatents contributors, '18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)', WikiPatents, , 6 June 2024, 02:18 UTC, <http://wikipatents.org/index.php?title=18401099._CONDUCTIVE_BUFFER_LAYERS_FOR_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=64666> [accessed 4 July 2024]

Chicago style

WikiPatents contributors, "18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=18401099._CONDUCTIVE_BUFFER_LAYERS_FOR_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=64666 (accessed July 4, 2024).

CBE/CSE style

WikiPatents contributors. 18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2024 Jun 6, 02:18 UTC [cited 2024 Jul 4]. Available from: http://wikipatents.org/index.php?title=18401099._CONDUCTIVE_BUFFER_LAYERS_FOR_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=64666.

Bluebook style

18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=18401099._CONDUCTIVE_BUFFER_LAYERS_FOR_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=64666 (last visited July 4, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18401099._CONDUCTIVE_BUFFER_LAYERS_FOR_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=64666",
   note = "[Online; accessed 4-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18401099. CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18401099._CONDUCTIVE_BUFFER_LAYERS_FOR_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_ASSOCIATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=64666}",
   note = "[Online; accessed 4-July-2024]"
 }