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Bibliographic details for 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
- Page name: 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 6 June 2024 02:11 UTC
- Date retrieved: 30 June 2024 06:24 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599
- Page Version ID: 64599
Citation styles for 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
APA style
18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation). (2024, June 6). WikiPatents, . Retrieved 06:24, June 30, 2024 from http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599.
MLA style
"18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)." WikiPatents, . 6 Jun 2024, 02:11 UTC. 30 Jun 2024, 06:24 <http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599>.
MHRA style
WikiPatents contributors, '18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)', WikiPatents, , 6 June 2024, 02:11 UTC, <http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599> [accessed 30 June 2024]
Chicago style
WikiPatents contributors, "18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599 (accessed June 30, 2024).
CBE/CSE style
WikiPatents contributors. 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jun 6, 02:11 UTC [cited 2024 Jun 30]. Available from: http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599.
Bluebook style
18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599 (last visited June 30, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599",
note = "[Online; accessed 30-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599}",
note = "[Online; accessed 30-June-2024]"
}
