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Bibliographic details for 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
- Page name: 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 6 June 2024 02:11 UTC
- Date retrieved: 2 July 2024 05:51 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599
- Page Version ID: 64599
Citation styles for 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
APA style
18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation). (2024, June 6). WikiPatents, . Retrieved 05:51, July 2, 2024 from http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599.
MLA style
"18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)." WikiPatents, . 6 Jun 2024, 02:11 UTC. 2 Jul 2024, 05:51 <http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599>.
MHRA style
WikiPatents contributors, '18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)', WikiPatents, , 6 June 2024, 02:11 UTC, <http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599> [accessed 2 July 2024]
Chicago style
WikiPatents contributors, "18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599 (accessed July 2, 2024).
CBE/CSE style
WikiPatents contributors. 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jun 6, 02:11 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599.
Bluebook style
18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599 (last visited July 2, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599", note = "[Online; accessed 2-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18071961._PERMANENT_LAYER_FOR_BUMP_CHIP_ATTACH_simplified_abstract_(Intel_Corporation)&oldid=64599}", note = "[Online; accessed 2-July-2024]" }