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Bibliographic details for 18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)

Citation styles for 18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)

APA style

18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.). (2024, June 6). WikiPatents, . Retrieved 06:37, July 4, 2024 from http://wikipatents.org/index.php?title=18430982._Chip_Stacked_Structure_and_Manufacturing_Method_Thereof,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract_(HUAWEI_TECHNOLOGIES_CO.,_LTD.)&oldid=64160.

MLA style

"18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)." WikiPatents, . 6 Jun 2024, 01:21 UTC. 4 Jul 2024, 06:37 <http://wikipatents.org/index.php?title=18430982._Chip_Stacked_Structure_and_Manufacturing_Method_Thereof,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract_(HUAWEI_TECHNOLOGIES_CO.,_LTD.)&oldid=64160>.

MHRA style

WikiPatents contributors, '18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)', WikiPatents, , 6 June 2024, 01:21 UTC, <http://wikipatents.org/index.php?title=18430982._Chip_Stacked_Structure_and_Manufacturing_Method_Thereof,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract_(HUAWEI_TECHNOLOGIES_CO.,_LTD.)&oldid=64160> [accessed 4 July 2024]

Chicago style

WikiPatents contributors, "18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18430982._Chip_Stacked_Structure_and_Manufacturing_Method_Thereof,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract_(HUAWEI_TECHNOLOGIES_CO.,_LTD.)&oldid=64160 (accessed July 4, 2024).

CBE/CSE style

WikiPatents contributors. 18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 6, 01:21 UTC [cited 2024 Jul 4]. Available from: http://wikipatents.org/index.php?title=18430982._Chip_Stacked_Structure_and_Manufacturing_Method_Thereof,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract_(HUAWEI_TECHNOLOGIES_CO.,_LTD.)&oldid=64160.

Bluebook style

18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.), http://wikipatents.org/index.php?title=18430982._Chip_Stacked_Structure_and_Manufacturing_Method_Thereof,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract_(HUAWEI_TECHNOLOGIES_CO.,_LTD.)&oldid=64160 (last visited July 4, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18430982._Chip_Stacked_Structure_and_Manufacturing_Method_Thereof,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract_(HUAWEI_TECHNOLOGIES_CO.,_LTD.)&oldid=64160",
   note = "[Online; accessed 4-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18430982._Chip_Stacked_Structure_and_Manufacturing_Method_Thereof,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract_(HUAWEI_TECHNOLOGIES_CO.,_LTD.)&oldid=64160}",
   note = "[Online; accessed 4-July-2024]"
 }


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