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Bibliographic details for 18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- Page name: 18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 31 May 2024 08:45 UTC
- Date retrieved: 28 June 2024 07:02 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18356035._SEMICONDUCTOR_DEVICES_INCLUDING_BONDED_SEMICONDUCTOR_LAYERS_AND_MANUFACTURING_METHODS_OF_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=63759
- Page Version ID: 63759
Citation styles for 18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
APA style
18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.). (2024, May 31). WikiPatents, . Retrieved 07:02, June 28, 2024 from http://wikipatents.org/index.php?title=18356035._SEMICONDUCTOR_DEVICES_INCLUDING_BONDED_SEMICONDUCTOR_LAYERS_AND_MANUFACTURING_METHODS_OF_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=63759.
MLA style
"18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 31 May 2024, 08:45 UTC. 28 Jun 2024, 07:02 <http://wikipatents.org/index.php?title=18356035._SEMICONDUCTOR_DEVICES_INCLUDING_BONDED_SEMICONDUCTOR_LAYERS_AND_MANUFACTURING_METHODS_OF_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=63759>.
MHRA style
WikiPatents contributors, '18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 31 May 2024, 08:45 UTC, <http://wikipatents.org/index.php?title=18356035._SEMICONDUCTOR_DEVICES_INCLUDING_BONDED_SEMICONDUCTOR_LAYERS_AND_MANUFACTURING_METHODS_OF_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=63759> [accessed 28 June 2024]
Chicago style
WikiPatents contributors, "18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18356035._SEMICONDUCTOR_DEVICES_INCLUDING_BONDED_SEMICONDUCTOR_LAYERS_AND_MANUFACTURING_METHODS_OF_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=63759 (accessed June 28, 2024).
CBE/CSE style
WikiPatents contributors. 18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 May 31, 08:45 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=18356035._SEMICONDUCTOR_DEVICES_INCLUDING_BONDED_SEMICONDUCTOR_LAYERS_AND_MANUFACTURING_METHODS_OF_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=63759.
Bluebook style
18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18356035._SEMICONDUCTOR_DEVICES_INCLUDING_BONDED_SEMICONDUCTOR_LAYERS_AND_MANUFACTURING_METHODS_OF_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=63759 (last visited June 28, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18356035._SEMICONDUCTOR_DEVICES_INCLUDING_BONDED_SEMICONDUCTOR_LAYERS_AND_MANUFACTURING_METHODS_OF_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=63759",
note = "[Online; accessed 28-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18356035. SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MANUFACTURING METHODS OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18356035._SEMICONDUCTOR_DEVICES_INCLUDING_BONDED_SEMICONDUCTOR_LAYERS_AND_MANUFACTURING_METHODS_OF_THE_SAME_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=63759}",
note = "[Online; accessed 28-June-2024]"
}
