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Bibliographic details for Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract

Citation styles for Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract

APA style

Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract. (2024, May 31). WikiPatents, . Retrieved 05:50, June 28, 2024 from http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240178189)._APPARATUSES_INCLUDING_REDISTRIBUTION_LAYERS_AND_EMBEDDED_INTERCONNECT_STRUCTURES_simplified_abstract&oldid=63428.

MLA style

"Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract." WikiPatents, . 31 May 2024, 08:03 UTC. 28 Jun 2024, 05:50 <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240178189)._APPARATUSES_INCLUDING_REDISTRIBUTION_LAYERS_AND_EMBEDDED_INTERCONNECT_STRUCTURES_simplified_abstract&oldid=63428>.

MHRA style

WikiPatents contributors, 'Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract', WikiPatents, , 31 May 2024, 08:03 UTC, <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240178189)._APPARATUSES_INCLUDING_REDISTRIBUTION_LAYERS_AND_EMBEDDED_INTERCONNECT_STRUCTURES_simplified_abstract&oldid=63428> [accessed 28 June 2024]

Chicago style

WikiPatents contributors, "Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240178189)._APPARATUSES_INCLUDING_REDISTRIBUTION_LAYERS_AND_EMBEDDED_INTERCONNECT_STRUCTURES_simplified_abstract&oldid=63428 (accessed June 28, 2024).

CBE/CSE style

WikiPatents contributors. Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract [Internet]. WikiPatents, ; 2024 May 31, 08:03 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240178189)._APPARATUSES_INCLUDING_REDISTRIBUTION_LAYERS_AND_EMBEDDED_INTERCONNECT_STRUCTURES_simplified_abstract&oldid=63428.

Bluebook style

Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract, http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240178189)._APPARATUSES_INCLUDING_REDISTRIBUTION_LAYERS_AND_EMBEDDED_INTERCONNECT_STRUCTURES_simplified_abstract&oldid=63428 (last visited June 28, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240178189)._APPARATUSES_INCLUDING_REDISTRIBUTION_LAYERS_AND_EMBEDDED_INTERCONNECT_STRUCTURES_simplified_abstract&oldid=63428",
   note = "[Online; accessed 28-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240178189)._APPARATUSES_INCLUDING_REDISTRIBUTION_LAYERS_AND_EMBEDDED_INTERCONNECT_STRUCTURES_simplified_abstract&oldid=63428}",
   note = "[Online; accessed 28-June-2024]"
 }


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