Cite This Page
Bibliographic details for International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract
- Page name: International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 31 May 2024 07:49 UTC
- Date retrieved: 28 June 2024 22:06 UTC
- Permanent URL: http://wikipatents.org/index.php?title=International_business_machines_corporation_(20240178143)._BURIED_OXIDE_LAYER_AND_ETCH_STOP_LAYER_PROCESS_FOR_DIRECT_BACK_SIDE_CONTACT_OF_SEMICONDUCTOR_DEVICE_simplified_abstract&oldid=63322
- Page Version ID: 63322
Citation styles for International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract
APA style
International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract. (2024, May 31). WikiPatents, . Retrieved 22:06, June 28, 2024 from http://wikipatents.org/index.php?title=International_business_machines_corporation_(20240178143)._BURIED_OXIDE_LAYER_AND_ETCH_STOP_LAYER_PROCESS_FOR_DIRECT_BACK_SIDE_CONTACT_OF_SEMICONDUCTOR_DEVICE_simplified_abstract&oldid=63322.
MLA style
"International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract." WikiPatents, . 31 May 2024, 07:49 UTC. 28 Jun 2024, 22:06 <http://wikipatents.org/index.php?title=International_business_machines_corporation_(20240178143)._BURIED_OXIDE_LAYER_AND_ETCH_STOP_LAYER_PROCESS_FOR_DIRECT_BACK_SIDE_CONTACT_OF_SEMICONDUCTOR_DEVICE_simplified_abstract&oldid=63322>.
MHRA style
WikiPatents contributors, 'International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract', WikiPatents, , 31 May 2024, 07:49 UTC, <http://wikipatents.org/index.php?title=International_business_machines_corporation_(20240178143)._BURIED_OXIDE_LAYER_AND_ETCH_STOP_LAYER_PROCESS_FOR_DIRECT_BACK_SIDE_CONTACT_OF_SEMICONDUCTOR_DEVICE_simplified_abstract&oldid=63322> [accessed 28 June 2024]
Chicago style
WikiPatents contributors, "International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=International_business_machines_corporation_(20240178143)._BURIED_OXIDE_LAYER_AND_ETCH_STOP_LAYER_PROCESS_FOR_DIRECT_BACK_SIDE_CONTACT_OF_SEMICONDUCTOR_DEVICE_simplified_abstract&oldid=63322 (accessed June 28, 2024).
CBE/CSE style
WikiPatents contributors. International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract [Internet]. WikiPatents, ; 2024 May 31, 07:49 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=International_business_machines_corporation_(20240178143)._BURIED_OXIDE_LAYER_AND_ETCH_STOP_LAYER_PROCESS_FOR_DIRECT_BACK_SIDE_CONTACT_OF_SEMICONDUCTOR_DEVICE_simplified_abstract&oldid=63322.
Bluebook style
International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract, http://wikipatents.org/index.php?title=International_business_machines_corporation_(20240178143)._BURIED_OXIDE_LAYER_AND_ETCH_STOP_LAYER_PROCESS_FOR_DIRECT_BACK_SIDE_CONTACT_OF_SEMICONDUCTOR_DEVICE_simplified_abstract&oldid=63322 (last visited June 28, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=International_business_machines_corporation_(20240178143)._BURIED_OXIDE_LAYER_AND_ETCH_STOP_LAYER_PROCESS_FOR_DIRECT_BACK_SIDE_CONTACT_OF_SEMICONDUCTOR_DEVICE_simplified_abstract&oldid=63322", note = "[Online; accessed 28-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=International_business_machines_corporation_(20240178143)._BURIED_OXIDE_LAYER_AND_ETCH_STOP_LAYER_PROCESS_FOR_DIRECT_BACK_SIDE_CONTACT_OF_SEMICONDUCTOR_DEVICE_simplified_abstract&oldid=63322}", note = "[Online; accessed 28-June-2024]" }