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Bibliographic details for 18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.)
- Page name: 18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 24 May 2024 08:14 UTC
- Date retrieved: 26 June 2024 12:44 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18308891._SEMICONDUCTOR_PACKAGE_INCLUDING_BUMP_INTERCONNECTION_STRUCTURE_simplified_abstract_(SK_hynix_Inc.)&oldid=61742
- Page Version ID: 61742
Citation styles for 18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.)
APA style
18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.). (2024, May 24). WikiPatents, . Retrieved 12:44, June 26, 2024 from http://wikipatents.org/index.php?title=18308891._SEMICONDUCTOR_PACKAGE_INCLUDING_BUMP_INTERCONNECTION_STRUCTURE_simplified_abstract_(SK_hynix_Inc.)&oldid=61742.
MLA style
"18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.)." WikiPatents, . 24 May 2024, 08:14 UTC. 26 Jun 2024, 12:44 <http://wikipatents.org/index.php?title=18308891._SEMICONDUCTOR_PACKAGE_INCLUDING_BUMP_INTERCONNECTION_STRUCTURE_simplified_abstract_(SK_hynix_Inc.)&oldid=61742>.
MHRA style
WikiPatents contributors, '18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.)', WikiPatents, , 24 May 2024, 08:14 UTC, <http://wikipatents.org/index.php?title=18308891._SEMICONDUCTOR_PACKAGE_INCLUDING_BUMP_INTERCONNECTION_STRUCTURE_simplified_abstract_(SK_hynix_Inc.)&oldid=61742> [accessed 26 June 2024]
Chicago style
WikiPatents contributors, "18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=18308891._SEMICONDUCTOR_PACKAGE_INCLUDING_BUMP_INTERCONNECTION_STRUCTURE_simplified_abstract_(SK_hynix_Inc.)&oldid=61742 (accessed June 26, 2024).
CBE/CSE style
WikiPatents contributors. 18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.) [Internet]. WikiPatents, ; 2024 May 24, 08:14 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18308891._SEMICONDUCTOR_PACKAGE_INCLUDING_BUMP_INTERCONNECTION_STRUCTURE_simplified_abstract_(SK_hynix_Inc.)&oldid=61742.
Bluebook style
18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.), http://wikipatents.org/index.php?title=18308891._SEMICONDUCTOR_PACKAGE_INCLUDING_BUMP_INTERCONNECTION_STRUCTURE_simplified_abstract_(SK_hynix_Inc.)&oldid=61742 (last visited June 26, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18308891._SEMICONDUCTOR_PACKAGE_INCLUDING_BUMP_INTERCONNECTION_STRUCTURE_simplified_abstract_(SK_hynix_Inc.)&oldid=61742",
note = "[Online; accessed 26-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18308891._SEMICONDUCTOR_PACKAGE_INCLUDING_BUMP_INTERCONNECTION_STRUCTURE_simplified_abstract_(SK_hynix_Inc.)&oldid=61742}",
note = "[Online; accessed 26-June-2024]"
}
