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Bibliographic details for 18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation)
- Page name: 18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 24 May 2024 07:31 UTC
- Date retrieved: 26 June 2024 06:50 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18419015._SIDEWAYS_VIAS_IN_ISOLATION_AREAS_TO_CONTACT_INTERIOR_LAYERS_IN_STACKED_DEVICES_simplified_abstract_(Intel_Corporation)&oldid=61442
- Page Version ID: 61442
Citation styles for 18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation)
APA style
18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation). (2024, May 24). WikiPatents, . Retrieved 06:50, June 26, 2024 from http://wikipatents.org/index.php?title=18419015._SIDEWAYS_VIAS_IN_ISOLATION_AREAS_TO_CONTACT_INTERIOR_LAYERS_IN_STACKED_DEVICES_simplified_abstract_(Intel_Corporation)&oldid=61442.
MLA style
"18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation)." WikiPatents, . 24 May 2024, 07:31 UTC. 26 Jun 2024, 06:50 <http://wikipatents.org/index.php?title=18419015._SIDEWAYS_VIAS_IN_ISOLATION_AREAS_TO_CONTACT_INTERIOR_LAYERS_IN_STACKED_DEVICES_simplified_abstract_(Intel_Corporation)&oldid=61442>.
MHRA style
WikiPatents contributors, '18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation)', WikiPatents, , 24 May 2024, 07:31 UTC, <http://wikipatents.org/index.php?title=18419015._SIDEWAYS_VIAS_IN_ISOLATION_AREAS_TO_CONTACT_INTERIOR_LAYERS_IN_STACKED_DEVICES_simplified_abstract_(Intel_Corporation)&oldid=61442> [accessed 26 June 2024]
Chicago style
WikiPatents contributors, "18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18419015._SIDEWAYS_VIAS_IN_ISOLATION_AREAS_TO_CONTACT_INTERIOR_LAYERS_IN_STACKED_DEVICES_simplified_abstract_(Intel_Corporation)&oldid=61442 (accessed June 26, 2024).
CBE/CSE style
WikiPatents contributors. 18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 May 24, 07:31 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18419015._SIDEWAYS_VIAS_IN_ISOLATION_AREAS_TO_CONTACT_INTERIOR_LAYERS_IN_STACKED_DEVICES_simplified_abstract_(Intel_Corporation)&oldid=61442.
Bluebook style
18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18419015._SIDEWAYS_VIAS_IN_ISOLATION_AREAS_TO_CONTACT_INTERIOR_LAYERS_IN_STACKED_DEVICES_simplified_abstract_(Intel_Corporation)&oldid=61442 (last visited June 26, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18419015._SIDEWAYS_VIAS_IN_ISOLATION_AREAS_TO_CONTACT_INTERIOR_LAYERS_IN_STACKED_DEVICES_simplified_abstract_(Intel_Corporation)&oldid=61442", note = "[Online; accessed 26-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18419015._SIDEWAYS_VIAS_IN_ISOLATION_AREAS_TO_CONTACT_INTERIOR_LAYERS_IN_STACKED_DEVICES_simplified_abstract_(Intel_Corporation)&oldid=61442}", note = "[Online; accessed 26-June-2024]" }