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Bibliographic details for 18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, May 24). WikiPatents, . Retrieved 13:45, June 26, 2024 from http://wikipatents.org/index.php?title=18419947._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61294.

MLA style

"18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 24 May 2024, 07:12 UTC. 26 Jun 2024, 13:45 <http://wikipatents.org/index.php?title=18419947._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61294>.

MHRA style

WikiPatents contributors, '18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 24 May 2024, 07:12 UTC, <http://wikipatents.org/index.php?title=18419947._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61294> [accessed 26 June 2024]

Chicago style

WikiPatents contributors, "18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18419947._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61294 (accessed June 26, 2024).

CBE/CSE style

WikiPatents contributors. 18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 May 24, 07:12 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18419947._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61294.

Bluebook style

18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18419947._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61294 (last visited June 26, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18419947._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61294",
   note = "[Online; accessed 26-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18419947. BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18419947._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61294}",
   note = "[Online; accessed 26-June-2024]"
 }


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