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Bibliographic details for 18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Page name: 18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 24 May 2024 07:11 UTC
- Date retrieved: 1 July 2024 09:54 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18156847._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61290
- Page Version ID: 61290
Citation styles for 18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
APA style
18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, May 24). WikiPatents, . Retrieved 09:54, July 1, 2024 from http://wikipatents.org/index.php?title=18156847._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61290.
MLA style
"18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 24 May 2024, 07:11 UTC. 1 Jul 2024, 09:54 <http://wikipatents.org/index.php?title=18156847._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61290>.
MHRA style
WikiPatents contributors, '18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 24 May 2024, 07:11 UTC, <http://wikipatents.org/index.php?title=18156847._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61290> [accessed 1 July 2024]
Chicago style
WikiPatents contributors, "18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18156847._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61290 (accessed July 1, 2024).
CBE/CSE style
WikiPatents contributors. 18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 May 24, 07:11 UTC [cited 2024 Jul 1]. Available from: http://wikipatents.org/index.php?title=18156847._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61290.
Bluebook style
18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18156847._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61290 (last visited July 1, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18156847._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61290", note = "[Online; accessed 1-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18156847._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61290}", note = "[Online; accessed 1-July-2024]" }