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Bibliographic details for 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, May 24). WikiPatents, . Retrieved 20:33, June 28, 2024 from http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283.

MLA style

"18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 24 May 2024, 07:10 UTC. 28 Jun 2024, 20:33 <http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283>.

MHRA style

WikiPatents contributors, '18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 24 May 2024, 07:10 UTC, <http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283> [accessed 28 June 2024]

Chicago style

WikiPatents contributors, "18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283 (accessed June 28, 2024).

CBE/CSE style

WikiPatents contributors. 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 May 24, 07:10 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283.

Bluebook style

18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283 (last visited June 28, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283",
   note = "[Online; accessed 28-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283}",
   note = "[Online; accessed 28-June-2024]"
 }


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