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Bibliographic details for 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Page name: 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 24 May 2024 07:10 UTC
- Date retrieved: 1 July 2024 00:47 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283
- Page Version ID: 61283
Citation styles for 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
APA style
18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, May 24). WikiPatents, . Retrieved 00:47, July 1, 2024 from http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283.
MLA style
"18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 24 May 2024, 07:10 UTC. 1 Jul 2024, 00:47 <http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283>.
MHRA style
WikiPatents contributors, '18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 24 May 2024, 07:10 UTC, <http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283> [accessed 1 July 2024]
Chicago style
WikiPatents contributors, "18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283 (accessed July 1, 2024).
CBE/CSE style
WikiPatents contributors. 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 May 24, 07:10 UTC [cited 2024 Jul 1]. Available from: http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283.
Bluebook style
18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283 (last visited July 1, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283", note = "[Online; accessed 1-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18152615._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61283}", note = "[Online; accessed 1-July-2024]" }