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Bibliographic details for 18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, May 24). WikiPatents, . Retrieved 05:07, June 28, 2024 from http://wikipatents.org/index.php?title=18421155._BILAYER_SEAL_MATERIAL_FOR_AIR_GAPS_IN_SEMICONDUCTOR_DEVICES_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61278.

MLA style

"18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 24 May 2024, 07:10 UTC. 28 Jun 2024, 05:07 <http://wikipatents.org/index.php?title=18421155._BILAYER_SEAL_MATERIAL_FOR_AIR_GAPS_IN_SEMICONDUCTOR_DEVICES_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61278>.

MHRA style

WikiPatents contributors, '18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 24 May 2024, 07:10 UTC, <http://wikipatents.org/index.php?title=18421155._BILAYER_SEAL_MATERIAL_FOR_AIR_GAPS_IN_SEMICONDUCTOR_DEVICES_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61278> [accessed 28 June 2024]

Chicago style

WikiPatents contributors, "18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18421155._BILAYER_SEAL_MATERIAL_FOR_AIR_GAPS_IN_SEMICONDUCTOR_DEVICES_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61278 (accessed June 28, 2024).

CBE/CSE style

WikiPatents contributors. 18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 May 24, 07:10 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=18421155._BILAYER_SEAL_MATERIAL_FOR_AIR_GAPS_IN_SEMICONDUCTOR_DEVICES_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61278.

Bluebook style

18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18421155._BILAYER_SEAL_MATERIAL_FOR_AIR_GAPS_IN_SEMICONDUCTOR_DEVICES_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61278 (last visited June 28, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18421155._BILAYER_SEAL_MATERIAL_FOR_AIR_GAPS_IN_SEMICONDUCTOR_DEVICES_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61278",
   note = "[Online; accessed 28-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18421155. BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18421155._BILAYER_SEAL_MATERIAL_FOR_AIR_GAPS_IN_SEMICONDUCTOR_DEVICES_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=61278}",
   note = "[Online; accessed 28-June-2024]"
 }


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