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Bibliographic details for 18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- Page name: 18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 24 May 2024 02:11 UTC
- Date retrieved: 26 June 2024 13:08 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18507459._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=60579
- Page Version ID: 60579
Citation styles for 18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
APA style
18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.). (2024, May 24). WikiPatents, . Retrieved 13:08, June 26, 2024 from http://wikipatents.org/index.php?title=18507459._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=60579.
MLA style
"18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 24 May 2024, 02:11 UTC. 26 Jun 2024, 13:08 <http://wikipatents.org/index.php?title=18507459._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=60579>.
MHRA style
WikiPatents contributors, '18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 24 May 2024, 02:11 UTC, <http://wikipatents.org/index.php?title=18507459._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=60579> [accessed 26 June 2024]
Chicago style
WikiPatents contributors, "18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18507459._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=60579 (accessed June 26, 2024).
CBE/CSE style
WikiPatents contributors. 18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 May 24, 02:11 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=18507459._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=60579.
Bluebook style
18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18507459._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=60579 (last visited June 26, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18507459._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=60579",
note = "[Online; accessed 26-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18507459. WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18507459._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=60579}",
note = "[Online; accessed 26-June-2024]"
}
