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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract

Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract

APA style

Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract. (2024, May 24). WikiPatents, . Retrieved 14:56, June 27, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162269)._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract&oldid=60164.

MLA style

"Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract." WikiPatents, . 24 May 2024, 00:57 UTC. 27 Jun 2024, 14:56 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162269)._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract&oldid=60164>.

MHRA style

WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract', WikiPatents, , 24 May 2024, 00:57 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162269)._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract&oldid=60164> [accessed 27 June 2024]

Chicago style

WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162269)._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract&oldid=60164 (accessed June 27, 2024).

CBE/CSE style

WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract [Internet]. WikiPatents, ; 2024 May 24, 00:57 UTC [cited 2024 Jun 27]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162269)._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract&oldid=60164.

Bluebook style

Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162269)._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract&oldid=60164 (last visited June 27, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162269)._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract&oldid=60164",
   note = "[Online; accessed 27-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240162269). BOND PAD STRUCTURE FOR BONDING IMPROVEMENT simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162269)._BOND_PAD_STRUCTURE_FOR_BONDING_IMPROVEMENT_simplified_abstract&oldid=60164}",
   note = "[Online; accessed 27-June-2024]"
 }


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