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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract

Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract

APA style

Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract. (2024, May 24). WikiPatents, . Retrieved 20:20, June 28, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162109)._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract&oldid=60153.

MLA style

"Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract." WikiPatents, . 24 May 2024, 00:55 UTC. 28 Jun 2024, 20:20 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162109)._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract&oldid=60153>.

MHRA style

WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract', WikiPatents, , 24 May 2024, 00:55 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162109)._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract&oldid=60153> [accessed 28 June 2024]

Chicago style

WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162109)._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract&oldid=60153 (accessed June 28, 2024).

CBE/CSE style

WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract [Internet]. WikiPatents, ; 2024 May 24, 00:55 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162109)._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract&oldid=60153.

Bluebook style

Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162109)._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract&oldid=60153 (last visited June 28, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162109)._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract&oldid=60153",
   note = "[Online; accessed 28-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240162109)._Package_with_Improved_Heat_Dissipation_Efficiency_and_Method_for_Forming_the_Same_simplified_abstract&oldid=60153}",
   note = "[Online; accessed 28-June-2024]"
 }


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