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Bibliographic details for Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract
- Page name: Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 23 May 2024 02:47 UTC
- Date retrieved: 21 June 2024 05:32 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240157472)._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=59494
- Page Version ID: 59494
Citation styles for Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract
APA style
Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract. (2024, May 23). WikiPatents, . Retrieved 05:32, June 21, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240157472)._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=59494.
MLA style
"Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract." WikiPatents, . 23 May 2024, 02:47 UTC. 21 Jun 2024, 05:32 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240157472)._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=59494>.
MHRA style
WikiPatents contributors, 'Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract', WikiPatents, , 23 May 2024, 02:47 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240157472)._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=59494> [accessed 21 June 2024]
Chicago style
WikiPatents contributors, "Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240157472)._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=59494 (accessed June 21, 2024).
CBE/CSE style
WikiPatents contributors. Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract [Internet]. WikiPatents, ; 2024 May 23, 02:47 UTC [cited 2024 Jun 21]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240157472)._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=59494.
Bluebook style
Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240157472)._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=59494 (last visited June 21, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240157472)._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=59494",
note = "[Online; accessed 21-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Samsung electronics co., ltd. (20240157472). WAFER PROCESSING APPARATUS AND WAFER DICING METHOD simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240157472)._WAFER_PROCESSING_APPARATUS_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=59494}",
note = "[Online; accessed 21-June-2024]"
}
