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Citation styles for 18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation)

APA style

18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation). (2024, April 26). WikiPatents, . Retrieved 19:39, June 23, 2024 from http://wikipatents.org/index.php?title=18400784._STRIPPED_REDISTRUBUTION-LAYER_FABRICATION_FOR_PACKAGE-TOP_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_simplified_abstract_(Intel_Corporation)&oldid=58664.

MLA style

"18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation)." WikiPatents, . 26 Apr 2024, 06:35 UTC. 23 Jun 2024, 19:39 <http://wikipatents.org/index.php?title=18400784._STRIPPED_REDISTRUBUTION-LAYER_FABRICATION_FOR_PACKAGE-TOP_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_simplified_abstract_(Intel_Corporation)&oldid=58664>.

MHRA style

WikiPatents contributors, '18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation)', WikiPatents, , 26 April 2024, 06:35 UTC, <http://wikipatents.org/index.php?title=18400784._STRIPPED_REDISTRUBUTION-LAYER_FABRICATION_FOR_PACKAGE-TOP_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_simplified_abstract_(Intel_Corporation)&oldid=58664> [accessed 23 June 2024]

Chicago style

WikiPatents contributors, "18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18400784._STRIPPED_REDISTRUBUTION-LAYER_FABRICATION_FOR_PACKAGE-TOP_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_simplified_abstract_(Intel_Corporation)&oldid=58664 (accessed June 23, 2024).

CBE/CSE style

WikiPatents contributors. 18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Apr 26, 06:35 UTC [cited 2024 Jun 23]. Available from: http://wikipatents.org/index.php?title=18400784._STRIPPED_REDISTRUBUTION-LAYER_FABRICATION_FOR_PACKAGE-TOP_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_simplified_abstract_(Intel_Corporation)&oldid=58664.

Bluebook style

18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18400784._STRIPPED_REDISTRUBUTION-LAYER_FABRICATION_FOR_PACKAGE-TOP_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_simplified_abstract_(Intel_Corporation)&oldid=58664 (last visited June 23, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18400784._STRIPPED_REDISTRUBUTION-LAYER_FABRICATION_FOR_PACKAGE-TOP_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_simplified_abstract_(Intel_Corporation)&oldid=58664",
   note = "[Online; accessed 23-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18400784._STRIPPED_REDISTRUBUTION-LAYER_FABRICATION_FOR_PACKAGE-TOP_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_simplified_abstract_(Intel_Corporation)&oldid=58664}",
   note = "[Online; accessed 23-June-2024]"
 }