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Bibliographic details for 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)

Citation styles for 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)

APA style

18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation). (2024, April 26). WikiPatents, . Retrieved 19:08, June 23, 2024 from http://wikipatents.org/index.php?title=18395351._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract_(Intel_Corporation)&oldid=58658.

MLA style

"18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)." WikiPatents, . 26 Apr 2024, 06:35 UTC. 23 Jun 2024, 19:08 <http://wikipatents.org/index.php?title=18395351._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract_(Intel_Corporation)&oldid=58658>.

MHRA style

WikiPatents contributors, '18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)', WikiPatents, , 26 April 2024, 06:35 UTC, <http://wikipatents.org/index.php?title=18395351._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract_(Intel_Corporation)&oldid=58658> [accessed 23 June 2024]

Chicago style

WikiPatents contributors, "18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18395351._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract_(Intel_Corporation)&oldid=58658 (accessed June 23, 2024).

CBE/CSE style

WikiPatents contributors. 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Apr 26, 06:35 UTC [cited 2024 Jun 23]. Available from: http://wikipatents.org/index.php?title=18395351._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract_(Intel_Corporation)&oldid=58658.

Bluebook style

18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18395351._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract_(Intel_Corporation)&oldid=58658 (last visited June 23, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18395351._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract_(Intel_Corporation)&oldid=58658",
   note = "[Online; accessed 23-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18395351._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract_(Intel_Corporation)&oldid=58658}",
   note = "[Online; accessed 23-June-2024]"
 }


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