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Bibliographic details for 17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation)
- Page name: 17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 26 April 2024 06:30 UTC
- Date retrieved: 20 June 2024 10:15 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17973316._WAFER-LEVEL_BOND_STRENGTH_MEASUREMENT_simplified_abstract_(Intel_Corporation)&oldid=58592
- Page Version ID: 58592
Citation styles for 17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation)
APA style
17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation). (2024, April 26). WikiPatents, . Retrieved 10:15, June 20, 2024 from http://wikipatents.org/index.php?title=17973316._WAFER-LEVEL_BOND_STRENGTH_MEASUREMENT_simplified_abstract_(Intel_Corporation)&oldid=58592.
MLA style
"17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation)." WikiPatents, . 26 Apr 2024, 06:30 UTC. 20 Jun 2024, 10:15 <http://wikipatents.org/index.php?title=17973316._WAFER-LEVEL_BOND_STRENGTH_MEASUREMENT_simplified_abstract_(Intel_Corporation)&oldid=58592>.
MHRA style
WikiPatents contributors, '17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation)', WikiPatents, , 26 April 2024, 06:30 UTC, <http://wikipatents.org/index.php?title=17973316._WAFER-LEVEL_BOND_STRENGTH_MEASUREMENT_simplified_abstract_(Intel_Corporation)&oldid=58592> [accessed 20 June 2024]
Chicago style
WikiPatents contributors, "17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17973316._WAFER-LEVEL_BOND_STRENGTH_MEASUREMENT_simplified_abstract_(Intel_Corporation)&oldid=58592 (accessed June 20, 2024).
CBE/CSE style
WikiPatents contributors. 17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Apr 26, 06:30 UTC [cited 2024 Jun 20]. Available from: http://wikipatents.org/index.php?title=17973316._WAFER-LEVEL_BOND_STRENGTH_MEASUREMENT_simplified_abstract_(Intel_Corporation)&oldid=58592.
Bluebook style
17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17973316._WAFER-LEVEL_BOND_STRENGTH_MEASUREMENT_simplified_abstract_(Intel_Corporation)&oldid=58592 (last visited June 20, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=17973316._WAFER-LEVEL_BOND_STRENGTH_MEASUREMENT_simplified_abstract_(Intel_Corporation)&oldid=58592",
note = "[Online; accessed 20-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=17973316._WAFER-LEVEL_BOND_STRENGTH_MEASUREMENT_simplified_abstract_(Intel_Corporation)&oldid=58592}",
note = "[Online; accessed 20-June-2024]"
}
