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Bibliographic details for 18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.)

APA style

18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.). (2024, April 26). WikiPatents, . Retrieved 12:52, June 17, 2024 from http://wikipatents.org/index.php?title=18244546._SEMICONDUCTOR_PACKAGE_INCLUDING_A_THREE-DIMENSIONAL_STACKED_MEMORY_MODULE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57625.

MLA style

"18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 26 Apr 2024, 05:27 UTC. 17 Jun 2024, 12:52 <http://wikipatents.org/index.php?title=18244546._SEMICONDUCTOR_PACKAGE_INCLUDING_A_THREE-DIMENSIONAL_STACKED_MEMORY_MODULE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57625>.

MHRA style

WikiPatents contributors, '18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 26 April 2024, 05:27 UTC, <http://wikipatents.org/index.php?title=18244546._SEMICONDUCTOR_PACKAGE_INCLUDING_A_THREE-DIMENSIONAL_STACKED_MEMORY_MODULE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57625> [accessed 17 June 2024]

Chicago style

WikiPatents contributors, "18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18244546._SEMICONDUCTOR_PACKAGE_INCLUDING_A_THREE-DIMENSIONAL_STACKED_MEMORY_MODULE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57625 (accessed June 17, 2024).

CBE/CSE style

WikiPatents contributors. 18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Apr 26, 05:27 UTC [cited 2024 Jun 17]. Available from: http://wikipatents.org/index.php?title=18244546._SEMICONDUCTOR_PACKAGE_INCLUDING_A_THREE-DIMENSIONAL_STACKED_MEMORY_MODULE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57625.

Bluebook style

18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18244546._SEMICONDUCTOR_PACKAGE_INCLUDING_A_THREE-DIMENSIONAL_STACKED_MEMORY_MODULE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57625 (last visited June 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18244546._SEMICONDUCTOR_PACKAGE_INCLUDING_A_THREE-DIMENSIONAL_STACKED_MEMORY_MODULE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57625",
   note = "[Online; accessed 17-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18244546._SEMICONDUCTOR_PACKAGE_INCLUDING_A_THREE-DIMENSIONAL_STACKED_MEMORY_MODULE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57625}",
   note = "[Online; accessed 17-June-2024]"
 }


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