Cite This Page

Jump to navigation Jump to search

Bibliographic details for Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract

Citation styles for Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract

APA style

Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract. (2024, April 26). WikiPatents, . Retrieved 23:33, June 25, 2024 from http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892.

MLA style

"Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract." WikiPatents, . 26 Apr 2024, 04:16 UTC. 25 Jun 2024, 23:33 <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892>.

MHRA style

WikiPatents contributors, 'Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract', WikiPatents, , 26 April 2024, 04:16 UTC, <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892> [accessed 25 June 2024]

Chicago style

WikiPatents contributors, "Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892 (accessed June 25, 2024).

CBE/CSE style

WikiPatents contributors. Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract [Internet]. WikiPatents, ; 2024 Apr 26, 04:16 UTC [cited 2024 Jun 25]. Available from: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892.

Bluebook style

Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract, http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892 (last visited June 25, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892",
   note = "[Online; accessed 25-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892}",
   note = "[Online; accessed 25-June-2024]"
 }


Retrieved from "http://wikipatents.org/index.php?title=Special:CiteThisPage"