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Bibliographic details for Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract
- Page name: Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 26 April 2024 04:16 UTC
- Date retrieved: 28 June 2024 20:00 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892
- Page Version ID: 56892
Citation styles for Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract
APA style
Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract. (2024, April 26). WikiPatents, . Retrieved 20:00, June 28, 2024 from http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892.
MLA style
"Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract." WikiPatents, . 26 Apr 2024, 04:16 UTC. 28 Jun 2024, 20:00 <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892>.
MHRA style
WikiPatents contributors, 'Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract', WikiPatents, , 26 April 2024, 04:16 UTC, <http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892> [accessed 28 June 2024]
Chicago style
WikiPatents contributors, "Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892 (accessed June 28, 2024).
CBE/CSE style
WikiPatents contributors. Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract [Internet]. WikiPatents, ; 2024 Apr 26, 04:16 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892.
Bluebook style
Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract, http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892 (last visited June 28, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892", note = "[Online; accessed 28-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Micron_technology,_inc._(20240128158)._TSV-BUMP_STRUCTURE,_SEMICONDUCTOR_DEVICE,_AND_METHOD_OF_FORMING_THE_SAME_simplified_abstract&oldid=56892}", note = "[Online; accessed 28-June-2024]" }