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Bibliographic details for Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract

Citation styles for Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract

APA style

Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract. (2024, April 26). WikiPatents, . Retrieved 05:22, June 26, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136250)._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract&oldid=55370.

MLA style

"Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract." WikiPatents, . 26 Apr 2024, 02:32 UTC. 26 Jun 2024, 05:22 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136250)._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract&oldid=55370>.

MHRA style

WikiPatents contributors, 'Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract', WikiPatents, , 26 April 2024, 02:32 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136250)._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract&oldid=55370> [accessed 26 June 2024]

Chicago style

WikiPatents contributors, "Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136250)._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract&oldid=55370 (accessed June 26, 2024).

CBE/CSE style

WikiPatents contributors. Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract [Internet]. WikiPatents, ; 2024 Apr 26, 02:32 UTC [cited 2024 Jun 26]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136250)._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract&oldid=55370.

Bluebook style

Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136250)._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract&oldid=55370 (last visited June 26, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136250)._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract&oldid=55370",
   note = "[Online; accessed 26-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136250)._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract&oldid=55370}",
   note = "[Online; accessed 26-June-2024]"
 }


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