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Citation styles for 18526290. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

APA style

18526290. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, April 12). WikiPatents, . Retrieved 05:55, June 21, 2024 from http://wikipatents.org/index.php?title=18526290._Semiconductor_Structure_Cutting_Process_and_Structures_Formed_Thereby_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50983.

MLA style

"18526290. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 12 Apr 2024, 08:55 UTC. 21 Jun 2024, 05:55 <http://wikipatents.org/index.php?title=18526290._Semiconductor_Structure_Cutting_Process_and_Structures_Formed_Thereby_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50983>.

MHRA style

WikiPatents contributors, '18526290. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 12 April 2024, 08:55 UTC, <http://wikipatents.org/index.php?title=18526290._Semiconductor_Structure_Cutting_Process_and_Structures_Formed_Thereby_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50983> [accessed 21 June 2024]

Chicago style

WikiPatents contributors, "18526290. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18526290._Semiconductor_Structure_Cutting_Process_and_Structures_Formed_Thereby_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50983 (accessed June 21, 2024).

CBE/CSE style

WikiPatents contributors. 18526290. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Apr 12, 08:55 UTC [cited 2024 Jun 21]. Available from: http://wikipatents.org/index.php?title=18526290._Semiconductor_Structure_Cutting_Process_and_Structures_Formed_Thereby_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50983.

Bluebook style

18526290. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=18526290._Semiconductor_Structure_Cutting_Process_and_Structures_Formed_Thereby_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50983 (last visited June 21, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18526290. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18526290._Semiconductor_Structure_Cutting_Process_and_Structures_Formed_Thereby_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50983",
   note = "[Online; accessed 21-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18526290. Semiconductor Structure Cutting Process and Structures Formed Thereby simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18526290._Semiconductor_Structure_Cutting_Process_and_Structures_Formed_Thereby_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=50983}",
   note = "[Online; accessed 21-June-2024]"
 }