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Citation styles for 18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.)

APA style

18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.). (2024, April 12). WikiPatents, . Retrieved 12:57, September 25, 2024 from http://wikipatents.org/index.php?title=18471715._INTERCONNECTION_LAYER_STRUCTURES_INCLUDING_TWO-DIMENSIONAL_(2D)_MATERIAL,_ELECTRONIC_DEVICES_INCLUDING_INTERCONNECTION_LAYER_STRUCTURES,_AND_ELECTRONIC_APPARATUSES_INCLUDING_ELECTRONIC_DEVICES_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=50056.

MLA style

"18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 12 Apr 2024, 07:46 UTC. 25 Sep 2024, 12:57 <http://wikipatents.org/index.php?title=18471715._INTERCONNECTION_LAYER_STRUCTURES_INCLUDING_TWO-DIMENSIONAL_(2D)_MATERIAL,_ELECTRONIC_DEVICES_INCLUDING_INTERCONNECTION_LAYER_STRUCTURES,_AND_ELECTRONIC_APPARATUSES_INCLUDING_ELECTRONIC_DEVICES_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=50056>.

MHRA style

WikiPatents contributors, '18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 12 April 2024, 07:46 UTC, <http://wikipatents.org/index.php?title=18471715._INTERCONNECTION_LAYER_STRUCTURES_INCLUDING_TWO-DIMENSIONAL_(2D)_MATERIAL,_ELECTRONIC_DEVICES_INCLUDING_INTERCONNECTION_LAYER_STRUCTURES,_AND_ELECTRONIC_APPARATUSES_INCLUDING_ELECTRONIC_DEVICES_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=50056> [accessed 25 September 2024]

Chicago style

WikiPatents contributors, "18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18471715._INTERCONNECTION_LAYER_STRUCTURES_INCLUDING_TWO-DIMENSIONAL_(2D)_MATERIAL,_ELECTRONIC_DEVICES_INCLUDING_INTERCONNECTION_LAYER_STRUCTURES,_AND_ELECTRONIC_APPARATUSES_INCLUDING_ELECTRONIC_DEVICES_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=50056 (accessed September 25, 2024).

CBE/CSE style

WikiPatents contributors. 18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Apr 12, 07:46 UTC [cited 2024 Sep 25]. Available from: http://wikipatents.org/index.php?title=18471715._INTERCONNECTION_LAYER_STRUCTURES_INCLUDING_TWO-DIMENSIONAL_(2D)_MATERIAL,_ELECTRONIC_DEVICES_INCLUDING_INTERCONNECTION_LAYER_STRUCTURES,_AND_ELECTRONIC_APPARATUSES_INCLUDING_ELECTRONIC_DEVICES_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=50056.

Bluebook style

18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18471715._INTERCONNECTION_LAYER_STRUCTURES_INCLUDING_TWO-DIMENSIONAL_(2D)_MATERIAL,_ELECTRONIC_DEVICES_INCLUDING_INTERCONNECTION_LAYER_STRUCTURES,_AND_ELECTRONIC_APPARATUSES_INCLUDING_ELECTRONIC_DEVICES_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=50056 (last visited September 25, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18471715._INTERCONNECTION_LAYER_STRUCTURES_INCLUDING_TWO-DIMENSIONAL_(2D)_MATERIAL,_ELECTRONIC_DEVICES_INCLUDING_INTERCONNECTION_LAYER_STRUCTURES,_AND_ELECTRONIC_APPARATUSES_INCLUDING_ELECTRONIC_DEVICES_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=50056",
   note = "[Online; accessed 25-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18471715. INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MATERIAL, ELECTRONIC DEVICES INCLUDING INTERCONNECTION LAYER STRUCTURES, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICES simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18471715._INTERCONNECTION_LAYER_STRUCTURES_INCLUDING_TWO-DIMENSIONAL_(2D)_MATERIAL,_ELECTRONIC_DEVICES_INCLUDING_INTERCONNECTION_LAYER_STRUCTURES,_AND_ELECTRONIC_APPARATUSES_INCLUDING_ELECTRONIC_DEVICES_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=50056}",
   note = "[Online; accessed 25-September-2024]"
 }