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Bibliographic details for Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract

Citation styles for Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract

APA style

Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract. (2024, April 11). WikiPatents, . Retrieved 12:02, June 27, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240105705)._Fan-Out_Package_with_Cavity_Substrate_simplified_abstract&oldid=48394.

MLA style

"Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract." WikiPatents, . 11 Apr 2024, 04:50 UTC. 27 Jun 2024, 12:02 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240105705)._Fan-Out_Package_with_Cavity_Substrate_simplified_abstract&oldid=48394>.

MHRA style

WikiPatents contributors, 'Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract', WikiPatents, , 11 April 2024, 04:50 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240105705)._Fan-Out_Package_with_Cavity_Substrate_simplified_abstract&oldid=48394> [accessed 27 June 2024]

Chicago style

WikiPatents contributors, "Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240105705)._Fan-Out_Package_with_Cavity_Substrate_simplified_abstract&oldid=48394 (accessed June 27, 2024).

CBE/CSE style

WikiPatents contributors. Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract [Internet]. WikiPatents, ; 2024 Apr 11, 04:50 UTC [cited 2024 Jun 27]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240105705)._Fan-Out_Package_with_Cavity_Substrate_simplified_abstract&oldid=48394.

Bluebook style

Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240105705)._Fan-Out_Package_with_Cavity_Substrate_simplified_abstract&oldid=48394 (last visited June 27, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240105705)._Fan-Out_Package_with_Cavity_Substrate_simplified_abstract&oldid=48394",
   note = "[Online; accessed 27-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240105705)._Fan-Out_Package_with_Cavity_Substrate_simplified_abstract&oldid=48394}",
   note = "[Online; accessed 27-June-2024]"
 }


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