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Bibliographic details for US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract

Citation styles for US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract

APA style

US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract. (2023, November 1). WikiPatents, . Retrieved 06:38, June 28, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18117869._MOLDING_APPARATUS_FOR_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=4811.

MLA style

"US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract." WikiPatents, . 1 Nov 2023, 03:40 UTC. 28 Jun 2024, 06:38 <http://wikipatents.org/index.php?title=US_Patent_Application_18117869._MOLDING_APPARATUS_FOR_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=4811>.

MHRA style

WikiPatents contributors, 'US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract', WikiPatents, , 1 November 2023, 03:40 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18117869._MOLDING_APPARATUS_FOR_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=4811> [accessed 28 June 2024]

Chicago style

WikiPatents contributors, "US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18117869._MOLDING_APPARATUS_FOR_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=4811 (accessed June 28, 2024).

CBE/CSE style

WikiPatents contributors. US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract [Internet]. WikiPatents, ; 2023 Nov 1, 03:40 UTC [cited 2024 Jun 28]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18117869._MOLDING_APPARATUS_FOR_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=4811.

Bluebook style

US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18117869._MOLDING_APPARATUS_FOR_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=4811 (last visited June 28, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=US_Patent_Application_18117869._MOLDING_APPARATUS_FOR_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=4811",
   note = "[Online; accessed 28-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18117869. MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18117869._MOLDING_APPARATUS_FOR_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=4811}",
   note = "[Online; accessed 28-June-2024]"
 }


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