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Bibliographic details for Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract

Citation styles for Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract

APA style

Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract. (2024, April 11). WikiPatents, . Retrieved 05:01, September 26, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240105677)._RECONSTITUTED_WAFER_WITH_SIDE-STACKED_INTEGRATED_CIRCUIT_DIE_simplified_abstract&oldid=47746.

MLA style

"Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract." WikiPatents, . 11 Apr 2024, 04:16 UTC. 26 Sep 2024, 05:01 <http://wikipatents.org/index.php?title=Intel_corporation_(20240105677)._RECONSTITUTED_WAFER_WITH_SIDE-STACKED_INTEGRATED_CIRCUIT_DIE_simplified_abstract&oldid=47746>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract', WikiPatents, , 11 April 2024, 04:16 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240105677)._RECONSTITUTED_WAFER_WITH_SIDE-STACKED_INTEGRATED_CIRCUIT_DIE_simplified_abstract&oldid=47746> [accessed 26 September 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240105677)._RECONSTITUTED_WAFER_WITH_SIDE-STACKED_INTEGRATED_CIRCUIT_DIE_simplified_abstract&oldid=47746 (accessed September 26, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract [Internet]. WikiPatents, ; 2024 Apr 11, 04:16 UTC [cited 2024 Sep 26]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240105677)._RECONSTITUTED_WAFER_WITH_SIDE-STACKED_INTEGRATED_CIRCUIT_DIE_simplified_abstract&oldid=47746.

Bluebook style

Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240105677)._RECONSTITUTED_WAFER_WITH_SIDE-STACKED_INTEGRATED_CIRCUIT_DIE_simplified_abstract&oldid=47746 (last visited September 26, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240105677)._RECONSTITUTED_WAFER_WITH_SIDE-STACKED_INTEGRATED_CIRCUIT_DIE_simplified_abstract&oldid=47746",
   note = "[Online; accessed 26-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240105677)._RECONSTITUTED_WAFER_WITH_SIDE-STACKED_INTEGRATED_CIRCUIT_DIE_simplified_abstract&oldid=47746}",
   note = "[Online; accessed 26-September-2024]"
 }


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