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Bibliographic details for Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract
- Page name: Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 10 April 2024 06:53 UTC
- Date retrieved: 7 July 2024 09:45 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Apple_inc._(20240107249)._MOLDED_INTEGRATED_CIRCUIT_PACKAGE_WITH_SENSOR_ASSEMBLY_simplified_abstract&oldid=47071
- Page Version ID: 47071
Citation styles for Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract
APA style
Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract. (2024, April 10). WikiPatents, . Retrieved 09:45, July 7, 2024 from http://wikipatents.org/index.php?title=Apple_inc._(20240107249)._MOLDED_INTEGRATED_CIRCUIT_PACKAGE_WITH_SENSOR_ASSEMBLY_simplified_abstract&oldid=47071.
MLA style
"Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract." WikiPatents, . 10 Apr 2024, 06:53 UTC. 7 Jul 2024, 09:45 <http://wikipatents.org/index.php?title=Apple_inc._(20240107249)._MOLDED_INTEGRATED_CIRCUIT_PACKAGE_WITH_SENSOR_ASSEMBLY_simplified_abstract&oldid=47071>.
MHRA style
WikiPatents contributors, 'Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract', WikiPatents, , 10 April 2024, 06:53 UTC, <http://wikipatents.org/index.php?title=Apple_inc._(20240107249)._MOLDED_INTEGRATED_CIRCUIT_PACKAGE_WITH_SENSOR_ASSEMBLY_simplified_abstract&oldid=47071> [accessed 7 July 2024]
Chicago style
WikiPatents contributors, "Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Apple_inc._(20240107249)._MOLDED_INTEGRATED_CIRCUIT_PACKAGE_WITH_SENSOR_ASSEMBLY_simplified_abstract&oldid=47071 (accessed July 7, 2024).
CBE/CSE style
WikiPatents contributors. Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract [Internet]. WikiPatents, ; 2024 Apr 10, 06:53 UTC [cited 2024 Jul 7]. Available from: http://wikipatents.org/index.php?title=Apple_inc._(20240107249)._MOLDED_INTEGRATED_CIRCUIT_PACKAGE_WITH_SENSOR_ASSEMBLY_simplified_abstract&oldid=47071.
Bluebook style
Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract, http://wikipatents.org/index.php?title=Apple_inc._(20240107249)._MOLDED_INTEGRATED_CIRCUIT_PACKAGE_WITH_SENSOR_ASSEMBLY_simplified_abstract&oldid=47071 (last visited July 7, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=Apple_inc._(20240107249)._MOLDED_INTEGRATED_CIRCUIT_PACKAGE_WITH_SENSOR_ASSEMBLY_simplified_abstract&oldid=47071",
note = "[Online; accessed 7-July-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=Apple_inc._(20240107249)._MOLDED_INTEGRATED_CIRCUIT_PACKAGE_WITH_SENSOR_ASSEMBLY_simplified_abstract&oldid=47071}",
note = "[Online; accessed 7-July-2024]"
}
