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Bibliographic details for Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract

Citation styles for Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract

APA style

Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract. (2024, April 10). WikiPatents, . Retrieved 14:15, June 17, 2024 from http://wikipatents.org/index.php?title=Apple_inc._(20240105702)._3D_Package_with_Chip-on-Reconstituted_Wafer_or_Reconstituted_Wafer-on-Reconstituted_Wafer_Bonding_simplified_abstract&oldid=47005.

MLA style

"Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract." WikiPatents, . 10 Apr 2024, 06:45 UTC. 17 Jun 2024, 14:15 <http://wikipatents.org/index.php?title=Apple_inc._(20240105702)._3D_Package_with_Chip-on-Reconstituted_Wafer_or_Reconstituted_Wafer-on-Reconstituted_Wafer_Bonding_simplified_abstract&oldid=47005>.

MHRA style

WikiPatents contributors, 'Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract', WikiPatents, , 10 April 2024, 06:45 UTC, <http://wikipatents.org/index.php?title=Apple_inc._(20240105702)._3D_Package_with_Chip-on-Reconstituted_Wafer_or_Reconstituted_Wafer-on-Reconstituted_Wafer_Bonding_simplified_abstract&oldid=47005> [accessed 17 June 2024]

Chicago style

WikiPatents contributors, "Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Apple_inc._(20240105702)._3D_Package_with_Chip-on-Reconstituted_Wafer_or_Reconstituted_Wafer-on-Reconstituted_Wafer_Bonding_simplified_abstract&oldid=47005 (accessed June 17, 2024).

CBE/CSE style

WikiPatents contributors. Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract [Internet]. WikiPatents, ; 2024 Apr 10, 06:45 UTC [cited 2024 Jun 17]. Available from: http://wikipatents.org/index.php?title=Apple_inc._(20240105702)._3D_Package_with_Chip-on-Reconstituted_Wafer_or_Reconstituted_Wafer-on-Reconstituted_Wafer_Bonding_simplified_abstract&oldid=47005.

Bluebook style

Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract, http://wikipatents.org/index.php?title=Apple_inc._(20240105702)._3D_Package_with_Chip-on-Reconstituted_Wafer_or_Reconstituted_Wafer-on-Reconstituted_Wafer_Bonding_simplified_abstract&oldid=47005 (last visited June 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Apple_inc._(20240105702)._3D_Package_with_Chip-on-Reconstituted_Wafer_or_Reconstituted_Wafer-on-Reconstituted_Wafer_Bonding_simplified_abstract&oldid=47005",
   note = "[Online; accessed 17-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Apple_inc._(20240105702)._3D_Package_with_Chip-on-Reconstituted_Wafer_or_Reconstituted_Wafer-on-Reconstituted_Wafer_Bonding_simplified_abstract&oldid=47005}",
   note = "[Online; accessed 17-June-2024]"
 }


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