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Bibliographic details for 18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)

Citation styles for 18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)

APA style

18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.). (2024, March 25). WikiPatents, . Retrieved 04:56, June 27, 2024 from http://wikipatents.org/index.php?title=18515090._MULTILAYER_ELECTRONIC_COMPONENT_FOR_ENHANCED_MOISTURE_RESISTANCE_AND_BENDING_STRENGTH_simplified_abstract_(Samsung_Electro-Mechanics_Co.,_Ltd.)&oldid=44733.

MLA style

"18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)." WikiPatents, . 25 Mar 2024, 07:55 UTC. 27 Jun 2024, 04:56 <http://wikipatents.org/index.php?title=18515090._MULTILAYER_ELECTRONIC_COMPONENT_FOR_ENHANCED_MOISTURE_RESISTANCE_AND_BENDING_STRENGTH_simplified_abstract_(Samsung_Electro-Mechanics_Co.,_Ltd.)&oldid=44733>.

MHRA style

WikiPatents contributors, '18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)', WikiPatents, , 25 March 2024, 07:55 UTC, <http://wikipatents.org/index.php?title=18515090._MULTILAYER_ELECTRONIC_COMPONENT_FOR_ENHANCED_MOISTURE_RESISTANCE_AND_BENDING_STRENGTH_simplified_abstract_(Samsung_Electro-Mechanics_Co.,_Ltd.)&oldid=44733> [accessed 27 June 2024]

Chicago style

WikiPatents contributors, "18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18515090._MULTILAYER_ELECTRONIC_COMPONENT_FOR_ENHANCED_MOISTURE_RESISTANCE_AND_BENDING_STRENGTH_simplified_abstract_(Samsung_Electro-Mechanics_Co.,_Ltd.)&oldid=44733 (accessed June 27, 2024).

CBE/CSE style

WikiPatents contributors. 18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Mar 25, 07:55 UTC [cited 2024 Jun 27]. Available from: http://wikipatents.org/index.php?title=18515090._MULTILAYER_ELECTRONIC_COMPONENT_FOR_ENHANCED_MOISTURE_RESISTANCE_AND_BENDING_STRENGTH_simplified_abstract_(Samsung_Electro-Mechanics_Co.,_Ltd.)&oldid=44733.

Bluebook style

18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.), http://wikipatents.org/index.php?title=18515090._MULTILAYER_ELECTRONIC_COMPONENT_FOR_ENHANCED_MOISTURE_RESISTANCE_AND_BENDING_STRENGTH_simplified_abstract_(Samsung_Electro-Mechanics_Co.,_Ltd.)&oldid=44733 (last visited June 27, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18515090._MULTILAYER_ELECTRONIC_COMPONENT_FOR_ENHANCED_MOISTURE_RESISTANCE_AND_BENDING_STRENGTH_simplified_abstract_(Samsung_Electro-Mechanics_Co.,_Ltd.)&oldid=44733",
   note = "[Online; accessed 27-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18515090._MULTILAYER_ELECTRONIC_COMPONENT_FOR_ENHANCED_MOISTURE_RESISTANCE_AND_BENDING_STRENGTH_simplified_abstract_(Samsung_Electro-Mechanics_Co.,_Ltd.)&oldid=44733}",
   note = "[Online; accessed 27-June-2024]"
 }


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