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Bibliographic details for 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- Page name: 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 25 March 2024 03:36 UTC
- Date retrieved: 20 September 2024 23:03 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443
- Page Version ID: 43443
Citation styles for 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
APA style
17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation). (2024, March 25). WikiPatents, . Retrieved 23:03, September 20, 2024 from http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443.
MLA style
"17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)." WikiPatents, . 25 Mar 2024, 03:36 UTC. 20 Sep 2024, 23:03 <http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443>.
MHRA style
WikiPatents contributors, '17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)', WikiPatents, , 25 March 2024, 03:36 UTC, <http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443> [accessed 20 September 2024]
Chicago style
WikiPatents contributors, "17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443 (accessed September 20, 2024).
CBE/CSE style
WikiPatents contributors. 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Mar 25, 03:36 UTC [cited 2024 Sep 20]. Available from: http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443.
Bluebook style
17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443 (last visited September 20, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443", note = "[Online; accessed 20-September-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=17932624._MICROELECTRONIC_ASSEMBLIES_WITH_MIXED_COPPER_AND_SOLDER_INTERCONNECTS_HAVING_DIFFERENT_THICKNESSES_simplified_abstract_(Intel_Corporation)&oldid=43443}", note = "[Online; accessed 20-September-2024]" }