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Bibliographic details for 18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, March 22). WikiPatents, . Retrieved 04:07, June 27, 2024 from http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803.

MLA style

"18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 22 Mar 2024, 08:25 UTC. 27 Jun 2024, 04:07 <http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803>.

MHRA style

WikiPatents contributors, '18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 22 March 2024, 08:25 UTC, <http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803> [accessed 27 June 2024]

Chicago style

WikiPatents contributors, "18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803 (accessed June 27, 2024).

CBE/CSE style

WikiPatents contributors. 18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Mar 22, 08:25 UTC [cited 2024 Jun 27]. Available from: http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803.

Bluebook style

18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803 (last visited June 27, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803",
   note = "[Online; accessed 27-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803}",
   note = "[Online; accessed 27-June-2024]"
 }


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