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Bibliographic details for 18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Page name: 18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 22 March 2024 08:25 UTC
- Date retrieved: 29 June 2024 19:52 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803
- Page Version ID: 41803
Citation styles for 18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
APA style
18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, March 22). WikiPatents, . Retrieved 19:52, June 29, 2024 from http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803.
MLA style
"18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 22 Mar 2024, 08:25 UTC. 29 Jun 2024, 19:52 <http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803>.
MHRA style
WikiPatents contributors, '18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 22 March 2024, 08:25 UTC, <http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803> [accessed 29 June 2024]
Chicago style
WikiPatents contributors, "18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803 (accessed June 29, 2024).
CBE/CSE style
WikiPatents contributors. 18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Mar 22, 08:25 UTC [cited 2024 Jun 29]. Available from: http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803.
Bluebook style
18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803 (last visited June 29, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803", note = "[Online; accessed 29-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18151663. Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18151663._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=41803}", note = "[Online; accessed 29-June-2024]" }